4-channel esd array in csp cm1204 ?2010 scillc. all rights reserved. publication order number: april 2010 ? rev. 3 cm1204/d features ? functionally and pin compatible with cmd?s cspesd304 ? optiguard ? tm coated for improved reliability ? four channels of esd protection ? 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? chip scale package features extremely low lead inductance for optimum esd protection ? 5-bump, 0.960mm x 1.330mm footprint chip scale package (csp) ? rohs compliant (lead-free) applications ? esd protection for sensitive electronic equipment ? i/o port and keypad and button circuitry protection for portable devices ? wireless handsets ? handheld pcs / pdas ? mp3 players ? digital camcorders ? notebooks ? desktop pcs product description the cm1204 is a quad esd transient voltage supressi on diode array. each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). these d iodes safely dissipate esd strikes of 15kv, exceeding th e maximum requirement of the iec 61000-4-2 internatio nal standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact discharges t o greater than + 30kv. the cm1204 is particularly well suited for portable electronics (e.g., cellular telephones, pdas, noteb ook computers) because of its small package format and low weight. the cm1204 features optiguard ? tm coating which results in improved reliability at assembly. it is available i n a space- saving, low-profile chip scale package with rohs- compliant lead-free finishing. block diagram b2 esd_1 gnd c1 c3 a1 a3 esd_2 esd_3 esd_4
cm1204 rev. 3 | page 2 of 9 | www.onsemi.com pin descriptions pin name description a1 esd_1 esd channel1 a3 esd_2 esd channel 2 b2 gnd device ground c1 esd_3 esd channel 3 c3 esd_4 esd channel 4 ordering information part numbering information pins package ordering part number 1 part marking 5 csp CM1204-03CP s parts are shipped in tape & reel form unless otherw ise specified.
cm1204 rev. 3 | page 3 of 9 | www.onsemi.com specifications absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc package power rating 200 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (see note 1) symbol parameter conditions min typ max units v diode diode reverse breakdown voltage i diode = 10 a 6.0 v i leak diode leakage current v in =3.3v, t a =25c 100 na v sig signal voltage positive clamp negative clamp i diode = 10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 note 2 30 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients note 2 +15 -8 v v c diode diode capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 22 27 32 pf note 1: t a =-40 to +85 c unless otherwise specified. note 2: esd applied to input and output pins with r espect to gnd, one at a time.
cm1204 rev. 3 | page 4 of 9 | www.onsemi.com performance information diode characteristics (nominal conditions unless sp ecified otherwise) figure 1. typical diode capacitance vs. input volt age (normalized to 2.5vdc) figure 2. frequency response (single channel vs. g nd, in 50 system)
cm1204 rev. 3 | page 5 of 9 | www.onsemi.com application information refer to application note ap-217, "the chip scale p ackage", for a detailed description of chip scale p ackages offered by california micro devices. printed circuit board recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tape red walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature 260?c figure 3. recommended non-solder mask defined pad illustration
cm1204 rev. 3 | page 6 of 9 | www.onsemi.com figure 4. lead-free (snagcu) solder ball reflow pr ofile
cm1204 rev. 3 | page 7 of 9 | www.onsemi.com mechanical details the cm1204 is offered in a custom chip scale package (csp). dimensions are presented below. package dimensions package custom csp bumps 5 millimeters inches dim min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters package dimensions for cm1204 chip scale package
cm1204 rev. 3 | page 8 of 9 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1204-03CP 1.33 x 0.96 x 0.644 1.42 x 1.07 x 0.740 8mm 178mm (7") 3500 4mm 4mm figure 5. tape and reel mechanical data
cm1204 rev. 3 | page 9 of 9 | www.onsemi.com on semiconductor and are registered trademarks of semiconductor componen ts industries, llc (scillc). scillc reserves the ri ght to make changes without further notice to any products herein. scillc makes no warranty, represe ntation or guarantee regarding the suitability of i ts products for any particular purpose, nor does sc illc assume any liability arising out of the application or use of any product or cir cuit, and specifically disclaims any and all liabil ity, including without limitation special, conseque ntial or incidental damages. ?typical? parameters which may be provided in scillc data she ets and/or specifications can and do vary in differ ent applications and actual performance may vary ov er time. all operating parameters, including ?typicals? must be validated for each customer application by customer's technic al experts. scillc does not convey any license und er its patent rights nor the rights of others. scillc products are not designed , intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other applicati on in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unau thorized application, buyer shall indemnify and hol d scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and ex penses, and reasonable attorney fees arising out of , directly or indirectly, any claim of personal inj ury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the des ign or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applic able copyright laws and is not for resale in any ma nner. publication ordering information literature fulfillment: literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone: 303-675-2175 or 800-344-3860 toll free usa/canada fax: 303-675-2176 or 800-344-3867 toll free usa/canada email: orderlit@onsemi.com n. american technical support: 800-282-9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81-3-5773-3850 on semiconductor website: www.onsemi.com order literature: http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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